Event Participation: SiliconPV Conference 2025

May 2, 2025

Researchers from imec (and TUDelft) recently participated in the SiliconPV Conference 2025, where Hamed Javanbakht Lomeri presented their latest findings on the “Impact of Carrier Foil Configurations on the Reliability of TWILL Interconnection Technology.”

πŸ” The study specifically evaluated the TWILL interconnection technology, that is being developed and upscaled within the SHINE PV consortium, through thermal cycling (TC) tests, showcasing outstanding fill factor (FF) retention even after 600 cycles (3Γ— IEC standard).

πŸ’‘ These results confirm the high reliability and robustness of this innovative interconnection technology.

Key takeaways from the event:
πŸ”΅ Industry is significantly ahead in terms of efficiency, size, process technology optimization
πŸ”΅ Surface passivation and pretreatments are scrutinized for squeezing out the last bits of efficiency in Si single junction
πŸ”΅ Options for reducing and replacing Ag content heavily investigated to address <2 mg/W targets
πŸ”΅ High-level discussion on overcapacity in the market (cannibalization of PV, grid cannot take more PV) vs. too little installation downstream (to address climate change, cannibalization is transient effect)

Stay tunned to learn more about the technologies developed in SHINE PV!